by I. Peric
Reference:
Hybrid Pixel Particle-Detector Without Bump Interconnection (I. Peric), In Nuclear Science, IEEE Transactions on, volume 56, 2009.
Bibtex Entry:
@Article{4812294,
author = "I. Peric",
title = "Hybrid Pixel Particle-Detector Without Bump
Interconnection",
journal = "Nuclear Science, IEEE Transactions on",
year = "2009",
volume = "56",
number = "2",
pages = "519--528",
month = apr,
doi = "10.1109/TNS.2009.2014951",
ISSN = "0018-9499",
keywords = "CMOS image sensors;diodes;electrodes;position
sensitive particle detectors;preamplifiers;readout
electronics;semiconductor counters;CMOS
charge-sensitive amplifiers;bump
interconnection;capacitive coupling;high-voltage CMOS
technology;high-voltage n-well/p-substrate
diodes;hybrid-pixel particle detector;in-pixel
amplification;picture size 14
pixel;preamplifiers;radioactive source spectra;readout
chip;sensor-collecting electrodes;signal
transmission;size 60 mum;size 78 mum;transmitter
electrodes;twin-wells;CMOS technology;Capacitive
sensors;Capacitors;Couplings;Diodes;Dispersion;Electrodes;Preamplifiers;Radio
transmitters;Testing;Bumpless
interconnection;high-voltage CMOS technology;hybrid
pixel-detector",
}