Publikationen P. Fischer & Arbeitsgruppe

by Rittweg R. Dand T., Beyer V. Cand E. and Sacco J. Gand I.

Reference:

Very compact, water-cooled SiPM module for PET/MRT applications (Rittweg R. Dand T., et al.), In 2015 European Microelectronics Packaging Conference (EMPC), 2015.

Bibtex Entry:

@InProceedings{7390760,
  author =       "R. {Dohle} and T. {Rittweg} and V. {Chernyshev} and E.
                 {Beyer} and J. {Goßler} and I. {Sacco} and P.
                 {Fischer}",
  booktitle =    "2015 European Microelectronics Packaging Conference
                 (EMPC)",
  title =        "Very compact, water-cooled Si{PM} module for
                 {PET}/{MRT} applications",
  year =         "2015",
  pages =        "1--6",
  keywords =     "application specific integrated circuits;ceramic
                 packaging;modules;photomultipliers;positron emission
                 tomography;thermal insulation;low temperature cofired
                 ceramic;application specific integrated circuit;water
                 cooled copper pipe;air cooling;thermal stability;SMD
                 component;flip-chip bonded;readout electronic;detector
                 module;thermal insulation;water cooling
                 channel;MRT;PET;magnetic resonance tomography
                 application;positron emission tomography;ASIC;silicon
                 photomultiplier;LTCC substrate;compact hybrid
                 circuit;water-cooled SiPM
                 module;Cooling;Substrates;Detectors;Manufacturing;Europe;Microelectronics;Packaging",
  ISSN =         "",
  URL =          "https://ieeexplore.ieee.org/document/7390760",
  month =        sep,
}