Some history of SPADIC in pictures
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March 2011: An enlarged photograph of a wire-bonded SPADIC v0.3 is shown. With good eyes and some fantasy one
can see a broken connection on the lower right edge of the die. The small pad-pitch of only 80µm
together with the large pad number made the bonding a big challenge. The final SPADIC will therefore
have an increased pad-pitch and an optimized number of pads.
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