Some history of SPADIC in pictures
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January 2011: The picture shows an Altium screenshot of the 3rd re-design of the SPADIC v0.3 front-end PCB. A completely new
separation scheme of all power and ground nets was realized to get rid of ground loops as
well as possible pickup-noise sources. The die will be glued on the red area that can be seen in the
middle of the picture. Wire-bonds will connect the chip's pads to the (red) wires and
power rings.
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